다운로드
다운로드

매뉴얼, 데이터 시트, 소프트웨어 등을 다운로드할 수 있습니다.

다운로드 유형
모델 또는 키워드

고속 시리얼 통신

차세대 디지털 인터페이스 표준(시리얼, 메모리, 디스플레이 등)은 다음을 비롯한 여러 고속 Tx 및 Rx 설계 문제를 야기하는 오늘날의 컴플라이언스 및 디버그 도구의 문제를 증폭시킵니다.

텍트로닉스는 PHY 검증 사이클 속도를 높이고 일관성을 보장하는, 자동화된 측정 제품군을 제공합니다. 컴플라이언스 측정이 실패할 경우 프로토콜 디코딩 및 비주얼 트리거 등과 같은 도구로 디버깅 속도를 높일 수 있습니다. 크로스토크(cross talk)나 기타 다중 레인 노이즈 커플링(multi-lane noise coupling) 등과 같은 소스로부터 지터 및 노이즈를 식별할 수 있습니다.

표준 및 기술

Library

Title
PCI Express® Transmitter PLL Testing — A Comparison of Methods
There are several methods of measuring PLL loop response, based on the type of test instrumentation used. As expected, the various methods trade off test accuracy, test speed (throughput), ease of us...
Characterizing an SFP+ Transceiver at the 16G Fibre Channel Rate
Study the measurements needed to test an SFP+ transceiver to the 16G Fibre Channel standard, covering both Multi- Mode 850 nm and Single Mode 1310 nm interfaces. Included is a test and characterizati...
High Speed Interface Standards
This e-Guide will help you learn more about design challenges for testing PCIe 4.0, SAS, SuperSpeed USB, and DDR4 standards. Within the pages of the eGuide you will also get quick access to technical ...
Fast+ Efficient Solutions for DVI Conformance Measurement Challenges
Tektronix provides all the DVI measurement solutions you need, ranging from high-bandwidth digital phosphor oscilloscopes (DPO) to probes to application-specific software. Tektronix has solved tough m...
Probing Tips for High Performance Design and Measurement
When a high performance system or component needs to be verified, it often requires attaching an oscilloscope probe. For high speed circuits, the effect of attaching a probe often cannot be ignored.  ...
Remote Head Acquisition Improves High Speed Serial Measurement
As high speed serial data rates continue to increase, the need to maximize margin in measurements increases. Coaxial cables, even good quality ones can impact the measurement margin. Remote heads for ...
The physical setup for USB 3.1 receiver calibration and testing is shown in this video.
This video highlights some of the newest features and capabilities of the USB 3.1 Receiver testing application. These updates enhance the functionality of the software, and give users more tools t...
This video details the the BERTScope's Error Location Analysis tool that provides a huge advantage for looking beyond compliance and debug system issues that can cause costly delays in design cycl...
The USB 3.1 Receiver application's Margin Test feature gives engineers quantitative answers on a design's performance and as a debug tool, a better understanding of where devices fail. This video ...
This video focuses on the Link Training Status State Machine UI feature of the USB 3.1 Gen2 Receiver test application and shows the path that is taken by a device being trained into loopback mode ...
This webinar provides insight into the future of mobile device design and test, with emphasis on the new C-PHY serial bus.
Watch this video to get an overview of the new Link Training Tool, which forms part of the expanded analysis software for Tektronix DPO70000SX oscilloscopes. Link Training helps engineers to verif...
1m 31s
The NEW P7700 Series TriMode Probe provides the highest probe fidelity available for real-time oscilloscopes. Watch our 60-second video to see how this new probe can help minimize noise and easily...
Tackle today's high-speed serial signals and tomorrow's too with the scalable, flexible DPO70000SX series. Watch this short video to see how.
Tektronix supports many applications where AWGs are heavily used, with plug-ins that improve overall efficiency by shortening the time it takes to build these complicated application test set-ups ...
This short video shows how to debug a compliance measurement that has failed by using Tektronix’ Jitter and Eye Diagram Software, DPOJET. Using DPOJET, engineers can go from a compliance environme...
The Tektronix P7700 TriMode Probe supports solder connections to a device under test. In this video, you will learn the Tektronix recommended procedure for attaching a solder tip to a device.
Title
Demystify MIPI D-PHY and C-PHY Transmitter and Receiver Physical Layer Test
During this webinar, you'll gain an understanding of MIPI test challenges for both MIPI high-speed physical layers. You'll also get useful tips and technical insights into characterizing and validatin...
How to Address Your Toughest Serial Bus Design Challenges with EDA and Measurement Correlation
This Tektronix webinar will teach engineers how to use modeling tools to correlate simulations with high-speed physical layer measurements on Serial Bus Standards using the DPO/MSO70000 Series Oscillo...