고속 시리얼 통신

차세대 디지털 인터페이스 표준(시리얼, 메모리, 디스플레이 등)은 다음을 비롯한 여러 고속 Tx 및 Rx 설계 문제를 야기하는 오늘날의 컴플라이언스 및 디버그 도구의 문제를 증폭시킵니다.

  • 소형 장치 구조로 인한 제한된 신호 액세스
  • 새로운 절전 체계에서의 버스 동작
  • 신호 인터페이스에서 새 신호 인코딩 및 평준화 기능 검증
  • 여러 전기 검증 테스트로 인한 시간 부족

텍트로닉스는 PHY 검증 사이클 속도를 높이고 일관성을 보장하는, 자동화된 측정 제품군을 제공합니다. 컴플라이언스 측정이 실패할 경우 프로토콜 디코딩 및 비주얼 트리거 등과 같은 도구로 디버깅 속도를 높일 수 있습니다. 크로스토크나 기타 다중 레인 노이즈 커플링 등과 같은 소스로부터 지터 및 노이즈를 식별할 수 있습니다.

표준 및 기술

라이브러리

Title
PCI Express® Transmitter PLL Testing — A Comparison of Methods

Overview of significant methods for performing PLL Testing

Probing Tips for High Performance Design and Measurement

Learn how to identify common signal integrity problems experienced in high speed and mobile designs, modeling techniques used to study and de-embed the effects of probing, probing considerations for low power circuits and much more in this detailed application note for high performance designs.

High Speed Interface StandardsThis e-Guide will help you learn more about design challenges for testing PCIe 4.0, SAS, SuperSpeed USB, and DDR4 standards. Within the pages of the eGuide you will also get quick access to technical resources that will help you understand design challenges and pick the right solution for your test needs.
Remote Head Acquisition Improves High Speed Serial Measurement

Learn how to maximize the margin in your signal integrity measurements.

Fast+ Efficient Solutions for DVI Conformance Measurement Challenges

Tektronix provides all the DVI measurement solutions you need, ranging from high-bandwidth digital phosphor oscilloscopes (DPO) to probes to application-specific software. Tektronix has solved tough measurement problems like jitter and eye diagram tests to assemble a DVI solution that automates and simplifies your work.

Characterizing an SFP+ Transceiver at the 16G Fibre Channel Rate

Measurements needed to test an SFP+ transceiver to the 16G Fibre Channel standard.

Testing your High Definition embedded devices using the HDMI Version 1.3 specification

Watch this video to get an overview of the new Link Training Tool, which forms…

1:31

Tackle today's high-speed serial signals and tomorrow's too with the scalable…

2:04

Tektronix supports many applications where AWGs are heavily used with plug-ins…

26:01

The Tektronix P7700 TriMode Probe supports solder connections to a device under…

5:58

The NEW P7700 Series TriMode Probe provides the highest probe fidelity available…

0:54

This webinar provides insight into the future of mobile device design and test,…

54:10
Title
Demystify MIPI D-PHY and C-PHY Transmitter and Receiver Physical Layer Test

During this webinar, you'll gain an understanding of MIPI test challenges for both MIPI high-speed physical layers and useful tips and technical insights into characterizing and validating design compliance.

How to Address Your Toughest Serial Bus Design Challenges with EDA and Measurement Correlation

This Tektronix webinar will teach engineers how to use modeling tools to correlate simulations with high-speed physical layer measurements on Serial Bus Standards using the DPO/MSO70000 Series Oscilloscopes.

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