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Tektronix Component Solutions: CLCC Packages

CLCC packages (ceramic leadless chip carriers) provide a lower-cost, Surface Mount Technology (SMT) compatible IC package solution. Well-suited for devices with low wire-bond / pin count configurations, CLCC packages have proven to be a viable solution for a variety of applications.

To meet the broadband performance requirements of telecommunications systems, military and aerospace applications, Tektronix Component Solutions offers a 40 GHz Ceramic Leadless Chip Carrier packaging platform. The CLCC platform provides a means to achieve next-generation performance in product development while managing aggressive design goals for hermeticity and reductions in size, weight and power (SWaP).

40 GHz CLCC Specifications:

40 GHz CLCC Case Study (PDF)

Typical Applications: